Electromigration-induced surface evolution in bamboo lines with transgranular and intergranular edge voids

Electromigration of Intergranular Voids in Metal Films for Microelectronic Interconnects

Voids and cracks often occur in the interconnect lines of microelec tronic devices They increase the resistance of the circuits and may even lead to a fatal failure Voids may occur inside a single grain but often they appear on the boundary between two grains In this work we model and analyze numerically the migration and evolution of an intergranular void subjected to surface di usion forces a...

A Phase Field Model for the Electromigration of Intergranular Voids

We consider a fully practical finite element approximation of the nonlinear degenerate parabolic system γ ∂u ∂t −∇.( b(u)∇[w + αφ] ) = 0 , `(γ) ∂v ∂t + z = 0 , w = −γΔu+ γ Ψ,u(u, v) , z = −γΔv + γΨ,v(u, v) , ∇.( c(u)∇φ) = 0 subject to initial conditions u0(∙) ∈ [−1, 1] on u, v0(∙) ∈ [− 1 √ 3 (1 + u0(∙)), 1 √ 3 (1 + u0(∙))] on v and flux boundary conditions. Here γ ∈ R>0, α ∈ R≥0, Ψ is a nonconv...

Electromigration Induced Evolution of Voids in Current Crowding Areas of Interconnects

Fracture Mechanism of CoCrMo Porous Nano-composite Prepared by Powder Metallurgy Route

The main aim of this research was to find the mechanism for the failure of the CoCrMo porous nano-composite by characterizing microstructural changes and fractured surface after compression test. For this purpose, porous nano-composites were prepared with the addition of bioactive glass nano-powder to Co-base alloy with 22.5% porosity by the combination of space-holder and powder metallurgy tec...

Strain evolution in Al conductor lines during electromigration

Monochromatic and white beam synchrotron x rays were used to study the deviatoric strains and full elastic strains in passivated Al conductor lines with near-bamboo structures during electromigration EM at 190 °C. A strong strain gradient formed in the upstream part of the Al lines. Strains along the downstream part of the lines were smaller and more scattered. Numerical analysis using the Eshe...